SUF301AM Datasheet | SeCoS Halbleitertechnologie GmbH

FEATURES - Low profile package - Glass Passivated Chip Juntion - Low reverse current - Lead free in ply with EU Ro HS 2011/65/EU directives MECHANICAL DATA - Case : SMAM - Terminals: Solderable per MIL-STD-750, Method 2026 - Weight: 27 mgram (Approximate) SMAM MARKING Part Number SUF301AM SUF302AM SUF303AM Marking Code ES3A ES3B ES3D PACKAGE INFORMATION Package SMAM 3K Part Number SUF304AM SUF305AM Marking Code ES3G ES3J Leader Size 7 inch REF. Millimeter Min. 3.20 Max. 3.70 2.40 2.80 4.40 4.90 REF. Millimeter Min. Max. 1 TYP. 1.30 1.60 0.90 1.20 ABSOLUTE MAXIMUM RATINGS (Rating 25°C ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive or inductive load. For capacitive load, de-rate current by 20%.) Parameter...