Download SUF301AM Datasheet PDF
SUF301AM page 2
Page 2

SUF301AM Key Features

  • Low profile package
  • Glass Passivated Chip Juntion
  • Low reverse current
  • Lead free in ply with EU RoHS 2011/65/EU directives
  • Case : SMAM
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Weight: 27 mgram (Approximate)