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SEMiX355MLI12M7 - IGBT

Key Features

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  • Solderless assembling solution with PressFIT signal pins and screw power terminals.
  • Trenchgate Technology.
  • VCE(sat) with positive temperature coefficient.
  • Low inductance case.
  • Reliable mechanical design with injection moulded terminals and reliable internal connections.
  • UL recognized file no. E63532.
  • NTC temperature sensor inside Typical.

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Full PDF Text Transcription (Reference)

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SEMiX355MLI12M7 SEMiX® 5 3-Level NPC IGBT-Module SEMiX355MLI12M7 Features* • Solderless assembling solution with PressFIT signal pins and screw power terminals • Trenchgate Technology • VCE(sat) with positive temperature coefficient • Low inductance case • Reliable mechanical design with injection moulded terminals and reliable internal connections • UL recognized file no. E63532 • NTC temperature sensor inside Typical Applications • UPS • Solar Remarks* • Case temperature limited to TC=125°C max.