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SK75GHL07F3TD1 - IGBT

Key Features

  • Compact design.
  • One screw mounting module.
  • Optimum heat transfer and insulation through direct copper bonding aluminum oxide ceramic (DBC).
  • 650V Trench3 Fast IGBT technology.
  • 650V Rapid switching diode.
  • Integrated NTC temperature sensor.
  • UL recognized, file no. E 63 532 Typical.

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SK75GHL07F3TD1 SEMITOP® 3 IGBT module Engineering Sample SK75GHL07F3TD1 Target Data Features • Compact design • One screw mounting module • Optimum heat transfer and insulation through direct copper bonding aluminum oxide ceramic (DBC) • 650V Trench3 Fast IGBT technology • 650V Rapid switching diode • Integrated NTC temperature sensor • UL recognized, file no.