SKKT323-12E Datasheet PDF (Thyristor) | Download Semikron SKKT323-12E

SKKT323-12E - Thyristor

Features

Industrial standard package.
Electrically insulated base plate.
Heat transfer through aluminum oxide ceramic insulated metal base plate.
Chip soldered on direct copper bonded Al2O3 ceramic.
Thyristor with center gate.
UL recognition applied for file no. E63532 VRSM VRRM VDRM (di/dt)cr (dv/dt)cr Tj Module Tstg Visol Characteristics Symbol Chip VT VT(TO) rT IDD;IRD tgd tgr tq IH IL VGT IGT VGD IGD Rth(j-c) Rth(j-c) Rth(j-c) Module Rth(c-s) M.

Datasheet Details

Part number	SKKT323-12E
Manufacturer	Semikron
File Size	704.74 KB
Description	Thyristor
Datasheet	SKKT323-12E Datasheet
Additional preview pages of the SKKT323-12E datasheet.

📁 Similar Datasheet

SKKT323 - Thyristor/Diode (Semikron International)

SKKT106 - THYRISTOR (INCHANGE)

SKKT107-16E - Thyristor Modules (Semikron International)

SKKT107B16E - Thyristor Modules (Semikron International)

SKKT122 - Thyristor / Diode Modules (Semikron International)

SKKT131 - Thyristor / Diode Modules (Semikron International)

SKKT132 - Thyristor / Diode Modules (Semikron International)

SKKT132H4 - Thyristor/Diode (Semikron International)

SKKT15 - Thyristor / Diode Modules (Semikron International)

SKKT161 - Thyristor / Diode Modules (Semikron International)

Full PDF Text Transcription

Click to expand full text

SKKT 323/12 E Absolute Maximum Ratings Symbol Chip IT(AV) ITSM i2t sinus 180° 10 ms 10 ms Tc = 85 °C Tc = 100 °C Tj = 25 °C Tj = 130 °C Tj = 25 °C Tj = 130 °C 320 241 9500 8200 451250 336200 1300 1200 1200 Tj = 130 °C Tj = 130 °C 130 1000 -40 ... 130 -40 ... 125 a.c.; 50 Hz; r.m.s. 1 min 1s 3000 3600 A A A A A²s A²s V V V A/µs V/µs °C °C V V Conditions Values Unit SEMIPACK® 3 Thyristor Modules SKKT 323/12 E Features • Industrial standard package • Electrically insulated base plate • Heat transfer through aluminum oxide ceramic insulated metal base plate • Chip soldered on direct copper bonded Al2O3 ceramic • Thyristor with center gate • UL recognition applied for file no.

Published: Jul 22, 2014 |