SKiiP703GD121-3DUW - IGBT POWER MODULE

Semikron

Datasheet Details

SKiiP technology inside - pressure contact of ceramic to heat sink; low thermal impedance - pressure contact of main electric terminals - pressure contact of auxiliary electric terminals - increased thermal cycling capability - low stray inductance - homogenous current distribution.
integrated current sensor.
integrated temperature sensor.
high power density 1) Theatsink = 25 °C, unless otherwise specified 2) CAL = Controlled Axial Lifetime Technology (soft a.

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Published: May 20, 2016 |