UL recognised file no. E63532
(dv/dt)cr Tj Module Tstg Visol
Characteristics Symbol
Chip VT VT(TO) rT IDD;IRD tgd tgr tq IH IL VGT IGT VGD IGD Rth(j-c) Module Rth(c-s) Ms Mt a w 350 per chip per module to heat sink (M5) to terminals (M6) 3 2.5 0.04 5 5 5.
9,81 K/W K/W Nm Nm m/s² g Tj = 25 °C, IT = 300 A Tj = 130 °C Tj = 130 °C Tj = 130 °C, VDD = VDRM; VRD = VRRM Tj = 25 °C, IG = 1 A, diG/dt =.
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SEMiX241DH16s
Absolute Maximum Ratings Symbol
Chip ID ITSM i2t Tj = 130 °C sinus 180° 10 ms 10 ms Tc = 85 °C Tc = 100 °C Tj = 25 °C Tj = 130 °C Tj = 25 °C Tj = 130 °C 240 200 2250 1900 25300 18000 1700 1600 1600 Tj = 130 °C Tj = 130 °C 100 1000 -40 ... 130 -40 ... 125 AC sinus 50Hz 1 min 1s 4000 4800 A A A A A²s A²s V V V A/µs V/µs °C °C V V
Conditions
Values
Unit
SEMiX® 13
VRSM VRRM VDRM (di/dt)cr
Bridge Rectifier Module (halfcontrolled) SEMiX241DH16s Features
• Terminal height 17 mm • Chips soldered directly to isolated substrate • UL recognised file no. E63532
(dv/dt)cr Tj Module Tstg Visol
Characteristics Symbol
Chip VT VT(TO) rT IDD;IRD tgd tgr tq IH IL VGT IGT VGD IGD Rth(j-c) Module Rth(c-s) Ms Mt a w 350 per chip per module to heat sink (M5) to terminals (M6) 3 2.5 0.