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SK35GB12T4 - IGBT

Key Features

  • Compact design.
  • One screw mounting.
  • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB).
  • High short circuit capability.
  • Trench4 IGBT technology.
  • CAL4F diode technology.
  • VCE,sat with positive coefficient.
  • UL recognized, file no. E 63 532 Typical.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SK 35 GB 12T4 SEMITOP® 2 IGBT module SK 35 GB 12T4 Features • Compact design • One screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB) • High short circuit capability • Trench4 IGBT technology • CAL4F diode technology • VCE,sat with positive coefficient • UL recognized, file no.