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PC923L0YSZ - OPIC Photocoupler

Download the PC923L0YSZ datasheet PDF. This datasheet also covers the PC923L0NSZ variant, as both devices belong to the same opic photocoupler family and are provided as variant models within a single manufacturer datasheet.

Description

PC923L0NSZ Series contains a LED optically coupled to an OPIC chip.

It is packaged in a 8 pin DIP, available in SMT gullwing lead form option.

Input-output isolation voltage(rms) is 5.0 kV, High speed response (tPHL, tPLH : MAX.

Features

  • . 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in direct drive circuit for MOSFET / IGBT drive (IO1P, IO2P : 0.6 A) 4. High speed response (tPHL, tPLH : MAX. 0.5 µs) 5. Wide operating supply voltage range (VCC=15 to 30 V) 6. High noise immunity due to high instantaneous com- mon mode rejection voltage (CMH : MIN.
  • 15kV/µs, CML : MIN. 15kV/µs) 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV).
  • Agency approvals/Compliance.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (PC923L0NSZ_SharpElectrionic.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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PC923L0NSZ OPIC Photocoupler Sharp Electrionic
PC923 High Speed Photocoupler for MOS-FET / IGBT Drive Sharp Electrionic Components
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PC921 HIGH POWER OPIC PHOTOCOUPLER Sharp Electrionic Components
PC922 High Power OPIC Photocoupler Sharp Electrionic Components

Other Datasheets by Sharp Corporation

Part Number Description
PC923L0YSZ0F OPIC Photocoupler
PC923L0YIP OPIC Photocoupler
PC923L0YIP0F OPIC Photocoupler
PC923L0NIP OPIC Photocoupler
PC923L0NIP0F OPIC Photocoupler

Full PDF Text Transcription

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PC923L0NSZ Series PC923L0NSZ Series High Speed, Gate Drive DIP 8 pin ∗OPIC Photocoupler ■ Description PC923L0NSZ Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead form option. Input-output isolation voltage(rms) is 5.0 kV, High speed response (tPHL, tPLH : MAX. 0.5 µs). ■ Features 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in direct drive circuit for MOSFET / IGBT drive (IO1P, IO2P : 0.6 A) 4. High speed response (tPHL, tPLH : MAX. 0.5 µs) 5. Wide operating supply voltage range (VCC=15 to 30 V) 6. High noise immunity due to high instantaneous com- mon mode rejection voltage (CMH : MIN. −15kV/µs, CML : MIN. 15kV/µs) 7.
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