GP1S096HCZ0F
GP1S096HCZ0F is Compact Transmissive Photointerrupter manufactured by Sharp Corporation.
Description
GP1S096HCZ0F is a pact-package, phototransistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides non-contact sensing. The pact package series is a result of unique technology bing transfer and injection molding. This device has a low profile.
- Agency approvals/pliance
1. pliant with Ro HS directive
- Applications
1. Detection of object presence or motion. 2. Example : printer, lens control for camera
- Features
1. Transmissive with phototransistor output 2. Highlights :
- pact Size
- Narrow Gap 3. Key Parameters :
- Gap Width : 1mm
- Slit Width (detector side): 0.3mm
- Package : 3.5×2.6×2.9mm 4. Lead free and Ro HS directive pliant
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D3-A00901EN Date Jun. 30. 2005 © SHARP Corporation
- Internal Connection Diagram
Top view
2 1 1 2 3 4 3 4
Anode Collector Emitter Cathode
- Outline Dimensions
Top view Gate position a' (C 0.3) a
(Unit : mm)
Light path center (0.75) 3.5 1 a-a' section (C0.4) 2.6 ∗∗∗ 2.9 (0.5) ∗∗∗ ∗∗ 0.4 (1) ∗2 (C0.3) (0.3) Slit width
0.2 0.15+
- 0.1
∗2.55
- Unspecified tolerance : ±0.2mm
- Dimensions in parenthesis are shown for reference
- The dimensions indicated by ∗ refer to those measured from the lead base.
- The dimensions shown do not include those of burrs Burr's dimensions : 0.15mm MAX.
- The lead may be exposed at the shaded portion
- ∗∗ This portion has no solder plating
- ∗∗∗ This portion does not have any solder plating in some cases
Product mass : approx. 0.05g Plating material : Sn Cu (Cu : TYP....
