Overview: 1M x 16-Bit Dynamic RAM (1k & 4k -Refresh) HYB3116160BSJ/BST(L)-50/-60/-70 HYB3118160BSJ/BST(L)-50/-60/-70 Advanced Information
• • • 1 048 576 words by 16-bit organization 0 to 70 °C operating temperature Performance: -50 tRAC tCAC tAA tRC tPC RAS access time CAS access time Access time from address Read/Write cycle time Fast page mode cycle time 50 13 25 90 35 -60 60 15 30 110 40 -70 70 20 35 130 45 ns ns ns ns ns • • • • • • • • • • Single + 3.3 V (± 0.3 V) supply Low power dissipation max. 720 active mW ( HYB3118160BSJ/BST-50) max. 648 active mW ( HYB3118160BSJ/BST-60) max. 576 active mW ( HYB3118160BSJ/BST-70) max. 360 active mW ( HYB3116160BSJ/BST-50) max. 324 active mW ( HYB3116160BSJ/BST-60) max. 288 active mW ( HYB3116160BSJ/BST-70) 7.2 mW standby (LV-TTL) 3.6 mW standby (LV-CMOS) 720 µW standby for L-version Output unlatched at cycle end allows two-dimensional chip selection Read, write, read-modify-write, CAS-before-RAS refresh, RAS-only refresh, hidden refresh, self refresh Fast page mode capability 2 CAS / 1 WE All inputs, outputs and clocks fully LV-TTL-compatible 1024 refresh cycles / 16 ms for HYB 3118160BSJ 4096 refresh cycles / 64 ms for HYB 3116160BSJ Plastic Package: P-SOJ-42-1 400 mil P-TSOPII-50/44-1 400mil Semiconductor Group 1 1.96 HYB3116(8)160BSJ/BST(L)-50/-60/-70 3.3V 1M x 16-DRAM The HYB 3116(8)160BSJ/BST is a 16 MBit dynamic RAM organized as 1 048 576 words by 16 bits. The HYB 3116(8)160BSJ/BST utilizes a submicron CMOS silicon gate process technology, as well as advanced circuit techniques to provide wide operating margins, both internally and for the system user. Multiplexed address inputs permit the HYB 3116(8)160BSJ/BST to be packaged in standard SOJ-42 and TSOPII-50/44 plastic package with 400mil width. These packages provide high system bit densities and are compatible with commonly used automatic testing and insertion equipment.
