SPD21N05L
SPU21N05L
Maximum Ratings
Parameter
Operating temperature
Storage temperature
Thermal resistance, junction - case
Thermal resistance, junction - ambient (PCB mount)**
Thermal resistance, junction - ambient
IEC climatic category, DIN IEC 68-1
Symbol
Tj
Tstg
RthJC
RthJA
RthJA
Values
-55 ... + 175
-55 ... + 175
≤ 2.7
≤ 50
≤ 100
55 / 175 / 56
Unit
°C
K/W
** when mounted on 1 " square PCB ( FR4 );for recommended footprint
Electrical Characteristics, at Tj = 25°C, unless otherwise specified
Parameter
Symbol
min.
Static Characteristics
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS=VDS, ID = 40 µA
Zero gate voltage drain current
VDS = 50 V, VGS = 0 V, Tj = -40 °C
VDS = 50 V, VGS = 0 V, Tj = 25 °C
VDS = 50 V, VGS = 0 V, Tj = 150 °C
Gate-source leakage current
VGS = 20 V, VDS = 0 V
Drain-Source on-resistance
VGS = 4.5 V, ID = 14 A
VGS = 10 V, ID = 14 A
V(BR)DSS
55
VGS(th)
1.2
IDSS
-
-
-
IGSS
-
RDS(on)
-
-
Values
typ.
max.
--
1.6 2
- 0.1
0.1 1
- 100
10 100
0.057
0.034
0.07
0.04
Unit
V
µA
nA
Ω
Semiconductor Group
2
29/Jan/1998
