Datasheet Summary
Features
- InGaP HBT Technology
- -52 dBc ACPR @ ±5 MHz, +27 dBm
- 30.5 dB Gain
- High Efficiency
- Low Transistor Junction Temperature
- Matched for a 50 Ω System
- Low Profile Miniature Surface Mount Package;
RoHS pliant
- Multi-Carrier Capability
- 2.17 GHz Small-Cell Power Amplifier Module
Data Sheet
APPLICATIONS
- WCDMA, HSDPA and LTE Air Interfaces
- Picocell, Femtocell, Home Nodes
- Customer Premises Equipment (CPE)
- Data Cards and Terminals
M52 Package 14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION The AWB7227 is a fully matched, Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (CPE) applications....
