BZT52B75
Overview
Value Unit Conditions PD Power Dissipation (Note 1) 410 mW VF Forward Voltage Drop 0.9 RθJA RθJL Thermal Resistance, Junction to Ambient Air (Note 2) Thermal Resistance, Junction to Lead 430 320 TJ, TSTG Operating Junction and Storage Temperature Range -55 to +150 Note: on 48cm2 FR-4 PCB. on an FR-4 PCB, with minimum recommeded pad. V °C/W °C IF=10mA TAITRON COMPONENTS INCORPORATED.
- Planar Die Construction
- 410mW Power Dissipation
- Zener Voltage 2.4v to 75v
- Zener Voltage Tolerance: ±2%
- Ideally Suited for Automated Assembly Processes
- RoHS Compliance SOD-123 Mechanical Data Case:
