Description
Power dissipation Power dissipation Operating Junction and Storage Temperature Range Max.Forward Voltage drop Typical Thermal Resistance PCB epoxy-glass path 1.5mm
Value 1.0 3.0 -65 to 175 1.
Features
- Glass Passivated chip junction.
- Low Zener Impedance.
- Excellent Clamping Capability.
- High temperature soldering guaranteed: 260˚C/10 seconds.
- RoHS Compliance SMA
Mechanical Data
Case: Epoxy: Terminals: Polarity: Weight: SMA (DO-214AC) molded plastic Plastic package has UL flammability 94V-0 Solder plated, solerable per IEC 68-2-20 Color band denotes cathode 0.064 gram
Maximum Ratings (T Ambient=25ºC unless noted otherwise)
Symbol
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Description Power dissipation Power dissipation Operating Junction and Storage Temperature Range Max. Forward Voltage drop Typical Thermal Resistance PCB epoxy-glass path 1.5mm
Value 1.0 3.0 -65 to 175 1.0 25 150 125 100
Unit W W °C V °C / W °C / W °C / W °C / W Ta=25 °C
Conditions
Ptot Ptot.
