Z1SMA47
Features
- Glass Passivated chip junction
- Low Zener Impedance
- Excellent Clamping Capability
- High temperature soldering guaranteed: 260˚C/10 seconds
- Ro HS pliance SMA
Mechanical Data
Case: Epoxy: Terminals: Polarity: Weight: SMA (DO-214AC) molded plastic Plastic package has UL flammability 94V-0 Solder plated, solerable per IEC 68-2-20 Color band denotes cathode 0.064 gram
Maximum Ratings (T Ambient=25ºC unless noted otherwise)
Symbol
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Description
Power dissipation Power dissipation Operating Junction and Storage Temperature Range Max. Forward Voltage drop Typical Thermal Resistance PCB epoxy-glass path 1.5mm
Value 1.0 3.0 -65 to 175 1.0 25 150 125 100
Unit W W °C V °C / W °C / W °C / W °C / W Ta=25 °C
Conditions
Ptot Ptot
Ta=25 °C, Rth JA= 25 °C / W
TJ,TSTG
VF Rth JC
IF=0.5A
Rth JA
PCB epoxy-glass path 5 x 10mm Ceramic Plate (Al2O3) path 5 x 10mm
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