* For surface mounted applications in order to optimize board space
* Low profile package
* Built-in strain relief
* Glass passivated junction
* Low .
in order to optimize board space
* Low profile package
* Built-in strain relief
* Glass passivated junction .
Peak Pulse Power Dissipation on TL=75°C, Measure at
PD Zero Lead Length
Derate above 75°C
RthJA
Thermal Resistance From Junction to Ambient
TJ,TSTG
Operating Junction and Storage Temperature Range
Note: 1. P.C.B. mounted 10x20mm copper pad area.
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