Description
Value
Unit
Conditions
PD Power Dissipation at Ta=25° C
500 mW
VF Forward Voltage
1.5 V IF=200mA
RthJA Thermal Resistance Junction to Ambient 0.3 K/mW
TJ Junction Temperature
175 ° C
TSTG Storage Temperature Range
-65 to +175
°C
Note: Valid provided that leads at a distance of 8mm from
Features
- Planar Die Construction.
- 500mW Power Dissipation.
- Very Sharp Reverse Characteristic.
- Very High Stability.
- Low Reverse Current Level.
- Standard Zener Voltage Tolerance is ± 5 %.
- Ideally Suited for Automated Assembly Processes.
- RoHS Compliant
Mechanical Data
Case: Terminals:
Polarity: Weight:
Molded Glass MiniMelf Solderable per MIL-STD-750, Method 2026 Color band denotes cathode end Approx. 0.03 grams
500mW Surface Mount.
ZMM24 Datasheet
