FK20X7R1E225K
Key Features
- High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology.
- High reliability is maintained under specified environmental conditions.
- Low residual inductance and excellent frequency characteristics has been achieved.
- The leads are formed with a "kink" to achieve consistent insertion heights and facilitate the release of gases during soldering for dramatically improved solderability.
- Taping specifications are available for automatic insertions, which contribute to reduce on-board costs.
