MLG0603Q0N6 Datasheet | TDK Corporation

FEATURES - It serializes a product of acquisition inductance 0.3 to15n H. In a product of 0.3 to 1.0n H, it realizes line up in a 0.1n H steppe. - By the most suitable design, Q is higher than peting in a conventional product MLG0603S type. In particular, Q in more than 800MHz largely improved. - Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency. - The products contain no lead and also support lead-free soldering. APPLICATIONS For high-frequency applications including mobile phones, high frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB and tuners. SHAPES AND DIMENSIONS 0.6±0.03 Conformity to Ro HS Directive PRODUCT IDENTIFICATION MLG 0603 Q 2N2 S T (1) (2) (3) (4) (5) (6) (1) Multilayer ceramic chip coil (2) Dimensions 0603 0.6× 0.3mm (L× W) (3) Series name (4) Inductance value 2N2 12N 2.2n H 12n H (5) Inductance tolerance B C S H J ±0.1n H ±0.2n H ±0.3n H ±3% ±5% 0.3±0.03 (6) Packaging style 0.06±0.04 Taping (reel) SPECIFICATIONS 0.3±0.03 Operating temperature range Storage temperature range Weight: 0.2mg - 55 to +125°C - 55 to +125°C [Unit of products] PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 15000 pieces/reel 0.15±0.05 Dimensions in mm REMENDED PC BOARD PATTERN 0.25 to 0.35 0.2 to 0.3 0.25 to 0.35 0.2 to 0.3 Dimensions in mm REMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C 230˚C Natural cooling HANDLING AND PRECAUTIONS - Before soldering, be sure to preheat ponents. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. - After mounting ponents onto the printed circuit board, do not apply stress through board bending or mishandling. - When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3...