MMZ0603Y471C Datasheet | TDK Corporation

(1/3) Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type Features - This is a multilayered chip bead product with dimensions of L0.6× W0.3× T0.3mm. - The product is magnetically shielded, allowing high density mounting. - We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz range. - It is a product conforming to Ro HS directive. APPLICATIONS The removal of EMI ponents from signal lines in various modules, cellular phones and other sets that use very small ponents. PRODUCT IDENTIFICATION MMZ 0603 S 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L× W (3) Material code (4) Nominal impedance 121:120Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping HANDLING AND PRECAUTIONS - Before soldering, be sure to preheat ponents. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. - After mounting ponents onto the printed circuit board, do not apply stress through board bending or mishandling. - Do not expose the inductors to stray magnetic fields. - Avoid static electricity discharge during handling. - When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. Conformity to Ro HS Directive MATERIAL CHARACTERISTICS S material: Standard type that Features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from...