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TDK

MPZ1608S331ATA00 Datasheet Preview

MPZ1608S331ATA00 Datasheet

Chip Beads

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MPZ1608S331ATA00
Applications
Commercial Grade
Feature
Power Line
Series
MPZ Series / MPZ1608 Type
Status
Production
Size
Length(L)
Width(W)
Thickness(T)
Recommended Land Pattern (A)
Recommended Land Pattern (B)
Recommended Land Pattern (C)
Electrical Characteristics
Impedance at 100MHz
Rated Current
DC Resistance [Max.]
Other
Operating Temp. Range (Including Self-Temp. Rise)
Soldering Method
AEC Q200
Packing
Package Quantity
Weight
1.60mm +/-0.15mm
0.80mm +/-0.15mm
0.80mm +/-0.15mm
0.60mm Nom.
0.80mm Nom.
0.80mm Nom.
330Ω +/-25%
1.7A
80mΩ
-55 to 125degC
Reflow, Iron Soldering
No
Punched (Paper)Taping [180mm Reel]
4000Pcs Min.
0.004g
1 of 2




TDK

MPZ1608S331ATA00 Datasheet Preview

MPZ1608S331ATA00 Datasheet

Chip Beads

No Preview Available !

MPZ1608S331ATA00
2 of 2
MPZ1608S331ATA00(|ZM|) PZ1608S331ATA00(R)MPZ1608S331ATA00(X)
MPZ1608S331ATA00
Temperature Rise by DC
no data available
MPZ1608S331ATA00
•This PDF document was created based on the data listed on the TDK Corporation website.
•All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved


Part Number MPZ1608S331ATA00
Description Chip Beads
Maker TDK
Total Page 2 Pages
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