GLF201208 Datasheet | TDK Corporation

FEATURES - It is low profile type. - It is lead-free patible. The product contains no lead whatsoever. It is able to withstand high temperature reflows (260°C during the peak) used in lead-free soldering. - It is a product conforming to Ro HS directive. .. - It’s construction supports bulk mounting. APPLICATIONS Portable audio visual devices (DSC, DVC, etc.) Mobile munication devices (cellular phones, LCD panel, etc.) SPECIFICATIONS Operating temperature range Storage temperature range - 40 to +105°C [Including self-temperature rise] - 40 to +105°C Conformity to Ro HS Directive PRODUCT IDENTIFICATION GLF (1) 201208 T 1R0 M (2) (3) (4) (5) (1) Series name (2) Dimensions 201208 2.0× 1.2× 0.8mm(L× W× T) REMENDED SOLDERING CONDITIONS REFLOW SOLDERING Withstanding soldering heat condition Solderability condition Peak 260˚C 230˚C 200˚C 30s 70s Preheating 100 to 150˚C/120s 140 to 180˚C/120s Time(s) Natural cooling (3) Packaging style T Taping (reel) (4) Inductance 1R0 100 1µH 10µH (5) Inductance tolerance M ±20% PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 4000 pieces/reel - Conformity to Ro HS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. - All specifications are subject to change without notice. 001-02 / 20060904 / e531_glf201208.fm (2/2) SHAPES AND DIMENSIONS/REMENDED PC BOARD PATTERN 2.0±0.10 1.25±0.10 0.8±0.10 0.80 0.80 1.00 2.60 0.80 Dimensions in mm 0.45±0.15 0.45±0.15 Weight:10mg Dimensions in mm ELECTRICAL CHARACTERISTICS Inductance (µH) 1 2.2 4.7 .. 10 22 47 ∗1 ∗2 ∗3 Inductance tolerance (%) ±20 ±20 ±20 ±20 ±20 ±20 DC resistance (Ω )±20% 0.15 0.36 0.66 1.1 2.6 5.3 Rated current∗ 1 (m A)max. 340 220 160 130 80 60 Rated current∗ 2 (m A)max. 460 300 230 170 110 80 Rated current∗ 3 (m A)max. 560 380 300 230 130 100 Part No. GLF201208T1R0M GLF201208T2R2M...