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THCOM
HIGH SPEED LAN 10/100BASE-TX MAGNETIC MODULE(SMD) F eature:
M Operating Temperature -40 ℃ To 85 ℃ M Designed To Meet IEEE802.3, ANSI X3.263 Standards M 16 PIN SMT Designed For Reflow Soldering Temperatures Up To 245 ℃ M Low Leakage Inductance And Winding Capacitances of Fast Rise Time High Isolaion Voltages To
Comply With International Safety. M Requirement For LAN . M Half Port and Single Port Designs for Maximum Layout Flexibility. M Compatible With INTEL ,TDK,QSI and Lcs Transiversce. M For ROHS Part add postfix G. T Isolation Voltage :1500Vrms.
E LECTRICAL
CHARACTERISTICS @25 ℃
Rise Time & Fall Time @ 5.0nS(Max),Isolation Hi-pot:1500Vrms(pri/sec),Pri.