Full PDF Text Transcription for MMDT3906 (Reference)
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MMDT3906. For precise diagrams, and layout, please refer to the original PDF.
MULTI-CHIP TRANSISTORS PNP Silicon MMDT3906 FEATURES ULTRA-SMALL SURFACE MOUNT PACKAGE EPITAXIAL PLANAR DIE CONSTRUCTION IDEAL FOR LOW POWER AMPLIFICATION AND SWITC...
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PLANAR DIE CONSTRUCTION IDEAL FOR LOW POWER AMPLIFICATION AND SWITCHING ALSO AVAILABLE IN LEAD FREE VERSION PB FREE PRODUCT ARE AVAILABLE :98.5% SN ABOVE CAN MEET ROHSENVIRONMENT SUBSTANCE DIRECTIVE REQUEST MECHANICAL DATA CASE：SOT-363 TERMINALS：SOLDERABLE PER MIL-STD-202G, METHOD 208 APPROX. WEIGHT:0.006 GRAM Halogen Free:MMDT3906-H . CASE：SOT-363 DIMENSIONS IN MILLIMETERS AND (INCHES) MAXIMUM RATINGS RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED.
MMDT3906 Datasheet
