Absolute Maximum Ratings (TA = 25° C unless otherwise noted)
Storage Temperature Range
Operating Temperature Range
Continuous Forward Current
Peak Forward Current (2µs pulse with 0.1% duty cycle)
Lead Soldering Temperature [1/16 inch (1.6 mm) from case for 5 seconds with soldering iron]
-65o C to +150o C
-65o C to +125o C
Electrical Characteristics (TA = 25° C unless otherwise noted)
MIN TYP MAX UNITS
Apertured Radiant Incidence
- mW/cm2 IF = 50 mA(4)
VF Forward Voltage
IR Reverse Current
λP Wavelength at Peak Emission
Spectral Bandwidth between
Half Power Points
V IF = 50 mA
µA VR= 2.0 V
- 890 -
nm IF = 10 mA
- 80 -
nm IF = 10 mA
∆λ /∆T Spectral Shift with Temperature
- +0.18 -
nm/°C IF = Constant
θHP Emission Angle at Half Power Points
tr Output Rise Time
tf Output Fall Time
- 24 - Degree IF = 50 mA
- 500 -
- 250 -
ns IF(PK)=100 mA, PW=10 µs, and
1. Refer to Application Bulletin 202 which reviews proper soldering techniques for pill-type devices.
2. No clean or low solids. RMA flux is recommended. Duration can be extended to 10 seconds maximum when flow soldering.
3. Derate linearly 1.50 mW/° C above 25° C.
4. For OP216, EE(APT) is a measurement using a 0.180” (4.57 mm) diameter apertured sensor placed 0.653” (16.59 mm) from the lens tip. EE(APT) is not
necessarily uniform within the measured area.
TT Electronics reserves the right to make changes in product specification without
notice or liability. All information is subject to TT Electronics’ own data and is
considered accurate at time of going to print.
© TT electronics plc
OPTEK Technology, Inc.
1645 Wallace Drive, Carrollton, TX 75006|Ph: +1 972 323 2200
www.optekinc.com | www.ttelectronics.com
Issue C 04/2018 Page 2