Datasheet4U Logo Datasheet4U.com

OPS698 - LED/Photosensor

Download the OPS698 datasheet PDF. This datasheet also covers the OPS666 variant, as both devices belong to the same led/photosensor family and are provided as variant models within a single manufacturer datasheet.

General Description

Each LED/Photosensor pair in the series consists of a gallium arsenide infrared emitting diode and a NPN silicon phototransistor, mounted in a T-1 package (OPS666, OPS667) or in a matched lateral side-looking plastic package (OPS691, OPS692, OPS693 and OPS698).

Key Features

  • High current transfer ratio.
  • Low-cost plastic package.
  • Lateral side-looking clear plastic package (OPS691, OPS692, OPS693 and OPS698) OPS666 - 667 OPS691 - 693 OPS698.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (OPS666-TT.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
OPSUN30S-B Single-button 2-output LED dimmable color temperature touch OPSUN

Other Datasheets by TT Electronics

Part Number Description
OPS691 LED/Photosensor
OPS692 LED/Photosensor
OPS693 LED/Photosensor
OPS665 LED/Photosensor
OPS666 LED/Photosensor

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
LED and Photosensor Pairs OPS666, OPS667, OPS691, OPS692, OPS693, OPS698 Features: • High current transfer ratio • Low-cost plastic package • Lateral side-looking clear plastic package (OPS691, OPS692, OPS693 and OPS698) OPS666 - 667 OPS691 - 693 OPS698 Description: Each LED/Photosensor pair in the series consists of a gallium arsenide infrared emitting diode and a NPN silicon phototransistor, mounted in a T-1 package (OPS666, OPS667) or in a matched lateral side-looking plastic package (OPS691, OPS692, OPS693 and OPS698). Matched pairs are desirable where the application is unique and the quantity required does not justify assembly tooling costs. If separation between the LED and sensor is greater than two times the specified IC(ON) distance, proper alignment becomes critical.