ARS25G Datasheet | Taiwan Semiconductor

FEATURES - Diffused junction - Low leakage - High surge capability - Low cost construction utilizing void-free molded plastic technique - pliant to Ro HS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition ARS25A thru ARS25M Taiwan Semiconductor MECHANICAL DATA Case: ARS Molding pound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - green pound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test Weight: 1.68 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25o C unless otherwise noted) PARAMETER ARS ARS ARS ARS ARS ARS SYMBOL 25A 25B 25D 25G 25J 25K Maximum repetitive peak reverse voltage Maximum RMS voltage VRRM VRMS 50 100 200 400 600 800 35 70 140 280 420 560 Maximum DC blocking voltage VDC 50 100 200 400 600 800 Maximum average forward rectified current IF(AV) Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM Maximum instantaneous forward voltage (Note 1) @ 25 A Maximum reverse current @ Rated VR TJ=25 o C TJ=125 o C Typical reverse recovery time (Note 2) trr Typical junction capacitance (Note 3) Cj Typical Thermal Resistance Operating junction temperature range Storage temperature range Note 1: Pulse test with PW=300μs, 1% duty cycle RθJC TJ TSTG Note 2: Reverse Recovery Time Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. 5 250 3...