Download B5817W Datasheet PDF
B5817W page 2
Page 2
B5817W page 3
Page 3

B5817W Key Features

  • Low Forward Voltage Drop
  • Surface Mounted Device
  • Moisture sensitivity level 1
  • Pb free and RoHS pliant
  • Case: Bend lead SOD-123 package
  • High temperature soldering guaranteed: 260°C/10s
  • Weight: 10mg (approximately)
  • 55 to + 150

B5817W Description

Green pound Green pound Green pound Green pound Document Number: A14 Small Signal Product PACKAGE OUTLINE DIMENSIONS SOD-123 B5817W/B5818W/B5819W Taiwan Semiconductor DIM.