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  Taiwan Semiconductor (TSMC) Electronic Components Datasheet  

ES3FB Datasheet

Surface Mount Super Fast Rectifier

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ES3AB - ES3JB
Taiwan Semiconductor
3A, 50V - 600V Surface Mount Super Fast Rectifier
FEATURES
Glass passivated junction chip
Ideal for automated placement
Low profile package
Super fast recovery time for high efficiency
Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
Halogen-free according to IEC 61249-2-21
APPLICATIONS
Switching mode power supply (SMPS)
Adapters
Lighting application
Converter
KEY PARAMETERS
PARAMETER
VALUE
UNIT
IF(AV)
VRRM
IFSM
TJ MAX
Package
3A
50 - 600
V
100 A
150 °C
DO-214AA (SMB)
Configuration
Single die
MECHANICAL DATA
Case: DO-214AA (SMB)
Molding compound meets UL 94V-0 flammability rating
Part no. with suffix Hmeans AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
Moisture sensitivity level: level 1,per J-STD-020
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 0.11 g (approximately)
DO-214AA (SMB)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
ES ES ES ES ES
SYMBOL
3AB 3BB 3CB 3DB 3FB
Marking code on the device
ES ES ES ES ES
3AB 3BB 3CB 3DB 3FB
Repetitive peak reverse voltage
VRRM
50 100 150 200 300
Reverse voltage, total rms value
VR(RMS)
30 70 105 140 210
Forward current
Surge peak forward current, 8.3
ms single half sine-wave
superimposed on rated load per
diode
IF(AV)
IFSM
3
100
Junction temperature
TJ
- 55 to +150
Storage temperature
TSTG
- 55 to +150
ES
3GB
ES
3GB
400
280
ES
3HB
ES
3HB
500
350
ES
UNIT
3JB
ES
3JB
600 V
420 V
A
A
°C
°C
1 Version:B1706


  Taiwan Semiconductor (TSMC) Electronic Components Datasheet  

ES3FB Datasheet

Surface Mount Super Fast Rectifier

No Preview Available !

ES3AB - ES3JB
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
LIMIT
Junction-to-lead thermal resistance
RӨJL
24
Junction-to-ambient thermal resistance
RӨJA
84
Junction-to-case thermal resistance
RӨJC
26
Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board)
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL TYP
Forward voltage per diode (1)
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
IF = 1.5A,TJ = 25°C
IF = 3.0A,TJ = 25°C
IF = 1.5A,TJ = 125°C
IF = 3.0A,TJ = 125°C
VF
VF
VF
VF
0.80
0.90
1.11
0.86
0.98
1.24
0.66
0.73
0.85
0.73
0.83
0.99
Reverse current @ rated VR per diode (2)
Junction capacitance
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
TJ = 25°C
TJ = 125°C
1 MHz, VR=4.0V
-
IR -
46
CJ
41
34
Reverse recovery time
Notes:
IF=0.5A ,IR=1.0A
IRR=0.25A
trr -
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
2
UNIT
°C/W
°C/W
°C/W
MAX UNIT
0.92 V
1.04 V
1.30 V
1.00 V
1.13 V
1.45 V
0.75 V
0.85 V
0.98 V
0.84 V
0.95 V
1.13 V
10 µA
100 µA
- pF
- pF
- pF
35 ns
Version:B1706


Part Number ES3FB
Description Surface Mount Super Fast Rectifier
Maker Taiwan Semiconductor
PDF Download

ES3FB Datasheet PDF






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