Multiple manufacture source Define manufacture source PACKAGE OUTLINE DIMENSIONS MELF SUGGEST PAD LAYOUT DIM.A B C ` Unit (mm) Min 4.80 2.25 0.30 Max 5.50 2.67 0.60 Unit (inch) Min 0.189 0.089 0.012 Max 0.217 0.105 0.024 DIM.C G X X1 Y Unit (mm) Typ.4.80 3.30 1.50 6.30 2.70 Unit (inch) Typ.0.189 0.130 0.059 0.248 0.106 Document Number: DS_S1412011 Version: G14 Small Signal Product LSR102 thru LSR106 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice.TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.Information contained herein is intended to provide a product description only.No license, express or implied,to any intellectual property rights is granted by.
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