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  Taiwan Semiconductor (TSMC) Electronic Components Datasheet  

RS1GL Datasheet

Surface Mount Fast Recovery Rectifiers

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CREAT BY ART
Surface Mount Fast Recovery Rectifiers
RS1AL thru RS1ML
Taiwan Semiconductor
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Fast switching for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: Sub SMA
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
Sub SMA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25unless otherwise noted)
PARAMETER
RS1 RS1 RS1 RS1 RS1 RS1
SYMBOL
AL BL DL GL JL KL
Marking code
RAL RBL RDL RGL RJL RKL
Maximum repetitive peak reverse voltage
VRRM
50 100 200 400 600 800
Maximum RMS voltage
VRMS
35 70 140 280 420 560
Maximum DC blocking voltage
VDC 50 100 200 400 600 800
Maximum average forward rectified current
IF(AV)
0.8
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
30
RS1
ML
RML
1000
700
1000
Maximum instantaneous forward voltage (Note 1)
@ 0.8 A
VF
1.3
Maximum reverse current @ rated VR TJ=25
TJ=125
IR
Typical junction capacitance (Note 2)
Cj
Maximum reverse recovery time (Note 3)
Trr
Typical thermal resistance
RθjL
RθjA
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
TJ
TSTG
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
5
50
10
150 250
32
105
- 55 to +150
- 55 to +150
500
UNIT
V
V
V
A
A
V
μA
pF
ns
OC/W
OC
OC
Document Number: DS_D1405034
Version: K14


  Taiwan Semiconductor (TSMC) Electronic Components Datasheet  

RS1GL Datasheet

Surface Mount Fast Recovery Rectifiers

No Preview Available !

RS1AL thru RS1ML
Taiwan Semiconductor
ORDERING INFORMATION
PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND
QUALIFIED
RS1xL
(Note 1)
Prefix "H"
RU
RV
RT
MT
RQ
MQ
R3
RF
R2
M2
RH
CODE
Suffix "G"
MH
Note 1: "x" defines voltage from 50V (RS1AL) to 1000V (RS1ML)
PACKAGE
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
PACKING
1,800 / 7" Plastic reel (8mm tape)
3,000 / 7" Plastic reel (8mm tape)
7,500 / 13" Paper reel (8mm tape)
7,500 / 13" Plastic reel (8mm tape)
10,000 / 13" Paper reel (8mm tape)
10,000 / 13" Plastic reel (8mm tape)
1,800 / 7" Plastic reel (12mm tape)
3,000 / 7" Plastic reel (12mm tape)
7,500 / 13" Paper reel (12mm tape)
7,500 / 13" Plastic reel (12mm tape)
10,000 / 13" Paper reel (12mm tape)
10,000 / 13" Plastic reel (12mm tape)
EXAMPLE
PREFERRED P/N PART NO.
RS1ML RU
RS1ML RUG
RS1MLHRU
RS1ML
RS1ML
RS1ML
AEC-Q101
QUALIFIED
H
PACKING CODE
RU
RU
RU
GREEN COMPOUND
CODE
G
DESCRIPTION
Green compound
AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA=25unless otherwise noted)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
25 50 75 100 125 150 175
LEAD TEMPERATURE (oC)
50
40
30
20
10
0
1
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
10
NUMBER OF CYCLES AT 60 Hz
100
Document Number: DS_D1405034
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
100
10 TJ=125
1
0.1 TJ=100
0.01
TJ=25
0.001
0
20 40 60 80 100 120 140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
10
Pulse Width=300μs
1% Duty Cycle
TJ=125
1
TJ=25
0.1
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
FORWARD VOLTAGE (V)
Version: K14


Part Number RS1GL
Description Surface Mount Fast Recovery Rectifiers
Maker Taiwan Semiconductor
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RS1GL Datasheet PDF






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