TSP10U60S Description
2 TYPICAL FORWARD CHARACTERISTICS 100 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) 15 10 5 WITH HEATSINK 30mm x 30mm 4 oz. 4 TYPICAL JUNCTION CAPACITANCE 10000 1000 f=1.0MHz Vsig=50mVp-p 100 0.1 1 10 REVERSE VOLTAGE (V) 100 Document Number: D14 PACKAGE OUTLINE DIMENSIONS TO-277A (SMPC) TSP10U60S Taiwan Semiconductor DIM.
TSP10U60S Key Features
- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Lower power loss/ high efficiency
- High forward surge capability
- Ideal for automated placement
- Moisture sensitivity level: level 1, per J-STD-020
- pliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
- 0.40 0.47