BZD27C270P Datasheet | Taiwan Semiconductor

Features — — — — — — Silicon planar zener diodes Low profile surface-mount package Zener and surge current specification Low leakage current Excellent stability High temperature soldering: 260OC / 10 sec. at terminals Sub SMA Mechanical Data — — — — Case: Sub SMA Plastic Packaging method: refer to package code Marking code: as table Weight: 10 mg (approx.) Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25℃ambient temperature unless otherwise specified. Maximum Ratings Type Number Forward Voltage Power Dissipation @ IF = 0.2A TL=80 C O TA=25 C (Note 1) Symbol VF Ptot PZSM PRSM PRSM RθJA RθJL TJ, TSTG Value 1.2 2.3 0.8 300 150 100 Units V W W W W K /W K /W O C Non-Repetitive Peak Pulse Power Dissipation 100us square pulse (Note 2) Non-Repetitive Peak Pulse Power Dissipation 10/1000 us waveform (BZD27-C7V5P to BZD27-C100P) (Note 2) Non-Repetitive Peak Pulse Power Dissipation 10/1000 us waveform (BZD27-110P to BZD27-C200P) (Note 2) Thermal Resistance Junction to Ambient Air (Note 1) Thermal Resistance Junction to Lead 180 30 Operating and Storage Temperature Range -65 to + 175 Notes: 1. Mounted on Epoxy-Glass PCB with 3 x 3 mm Cu pads (≧40um thick) 2. TJ=25OC Prior to Surge. 05.07.2006/rev.g .. ELECTRICAL CHARACTERISTICS (TA=25OC Working Voltage unless otherwise noted) Temperature Device Device Marking Code E2 E3 E4 E5 E6 E7 E8 E9 F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 H0 H1 H2 H3 H4 H5 BZD27C11P BZD27C12P BZD27C13P BZD27C15P BZD27C16P BZD27C18P BZD27C20P BZD27C22P BZD27C24P BZD27C27P BZD27C30P BZD27C33P BZD27C36P BZD27C39P BZD27C43P BZD27C47P BZD27C51P BZD27C56P BZD27C62P BZD27C68P BZD27C75P BZD27C82P BZD27C91P BZD27C100P BZD27C110P BZD27C120P BZD27C130P BZD27C150P BZD27C160P BZD27C180P BZD27C200P BZD27C220P BZD27C240P BZD27C270P (Note 1) Vz @ IZT V Min. Max. 10.4 11.6 11.4 12.7 12.4 14.1 13.8 15.6 15.3 17.1 16.8 19.1 18.8 21.2 20.8 23.3 22.8 25.6 25.1 28.9 28 32 31 35 34 38 37 41...