TRCM453232 - Wire Wound RF SMD Inductor

Token

Download the TRCM453232 datasheet PDF. This datasheet also covers the TRCM322522 variant, as both devices belong to the same wire wound rf smd inductor family and are provided as variant models within a single manufacturer datasheet.

Key Features

:.
High resistance to heat and humidity.
Resistant to mechanical shocks and pressures.
Accurate dimensions for automatically surface mounted.
Good heat durability that withstands lead-free compatible reflow soldering conditions. Materials:.
Ferrite DR core, enamelled copper wire, tinned copper flat, epoxy novolac moldind compound.

📥 Download Datasheet

TRCM453232 wire wound rf smd inductor by Token - Datasheet Preview — Note: The manufacturer provides a single datasheet file (TRCM322522-Token.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number	TRCM453232
Manufacturer	Token
File Size	401.41 KB
Description	Wire Wound RF SMD Inductor
Datasheet	TRCM453232 Datasheet

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Other Datasheets by Token

Part Number	Description
TRCM322522	Wire Wound RF SMD Inductor

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text

 Product Introduction RF Chip Wire wound inductors Go To Extremes Superior Performance. Features :  High resistance to heat and humidity.  Resistant to mechanical shocks and pressures.  Accurate dimensions for automatically surface mounted.  Good heat durability that withstands lead-free compatible reflow soldering conditions. Materials:  Ferrite DR core, enamelled copper wire, tinned copper flat, epoxy novolac moldind compound Applications :  Other electronic equipment including HDDs and ODDs.  Audio-visual equipment including TVs,VCRs and digital cameras.  Electronic equipment used in onboard automobile equipment including car audio and ECU systems.  Electronic equipment used in communication infrastructures infrastructures including xDSL and mobile base stations.