Photocouplers Infrared LED & Photo IC
TLP109(IGM)
TLP109(IGM)
1. Applications
• Intelligent Power Module Signal Isolation
• High-Speed Digital Interfacing for Instrumentation and Control Devices
• Industrial Inverters
2. General
The Toshiba TLP109(IGM) mini-flat coupler is a small-outline coupler suitable for surface-mount assembly. The
TLP109(IGM) consists of an infrared LED optically coupled to a high-speed photodiode-transistor chip. The
TLP109(IGM) is housed in the SO6 package and guarantees a creepage distance of ≥5.0 mm, a clearance of ≥5.0
mm and an insulation thickness of ≥0.4mm. Therefore, the TLP109(IGM) meets the reinforced insulation class
requirements of international safety standards. The TLP109(IGM) guarantees minimum and maximum of
propagation delay time, switching time dispersion, and high common mode transient immunity. Therefore TLP109
(IGM) is suitable for isolation interface between IPM(Intelligent Power Module) and control IC circuits in motor
control application.
3. Features
(1) Isolation voltage: 3750 Vrms (min)
(2) Common-mode transient immunity: 10 kV/µs (min)
@VCM = 1500 Vp-p
(3) Propagation delay time tpHL/tpLH = 0.1 µs (min)
= 0.8 µs (max)
@ IF = 10 mA, VCC = 15 V,
RL = 20 kΩ, Ta = 25
(4) Pulse width distortion: 0.7 µs (max) (|tpHL-tpLH|)
(5) TTL compatible
(6) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
CQC-approved: GB4943.1, GB8898 Thailand Factory
Note 1: When a VDE approved type is needed, please designate the Option (V4).
©2017-2019
Toshiba Electronic Devices & Storage Corporation
1
Start of commercial production
2008-07
2019-09-20
Rev.2.0
