Absolute Maximum Ratings (Ta=25°C)
SYMBOL RATING UNIT
Forward Current Derating (Ta ≥ 95°C)
Peak Transient Forward Current
(Note 1)(Note 2)
Peak Transient Forward Current Derating (Ta ≥ 95°C)
Diode power dissipation
Diode power dissipation derating (Ta ≥ 95°C)
Output Current (Ta ≤ 100°C)
Output Power Dissipation
Operating Temperature Range
-40 to 100 °C
Storage Temperature Range
-55 to 125 °C
Lead Soldering Temperature (10 s)
Isolation Voltage (AC, 60 s, R.H.≤ 60 %)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the
operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note 1: Each channel.
Note 2: Pulse width ≤ 1 ms, duty = 50 %.
Note 3: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together,
as are pins 5, 6, 7 and 8.
Recommended Operating Conditions
SYMBOL MIN TYP. MAX UNIT
Input Current , High Level
Input Voltage , Low Level
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this product,
please confirm specified characteristics shown in this document.
Toshiba Electronic Devices & Storage Corporation