Absolute Maximum Ratings (Ta = 25°C)
TLP3762F(S)
Characteristic
Symbol
Rating
Unit
Forward current
Forward current derating (Ta ≥ 53 °C)
Peak forward current (100 µs pulse, 100 pps)
Reverse voltage
Power dissipation
Power dissipation derating (Ta ≥ 53°C)
Junction temperature
Off-state output terminal voltage
On-state RMS current
On-state current derating (Ta ≥ 25°C)
Peak on-state current (100 µs pulse, 120 pps)
Peak nonrepetitive surge current (Pw = 10 ms)
Power dissipation
Power dissipation derating (Ta ≥ 25 °C)
Junction temperature
Operating temperature range
Storage temperature range
Lead soldering temperature (10 s)
Total package power dissipation
Total package power dissipation derating
(Ta ≥ 25°C)
Isolation voltage (AC, 60 s. , R.H. ≤ 60 %)
Ta=25°C
Ta=70°C
(Note 1)
IF
∆IF /°C
IFP
VR
PD
ΔPD / °C
Tj
VDRM
IT(RMS)
ΔIT / °C
ITP
ITSM
PD
ΔPD / °C
Tj
Topr
Tstg
Tsol
PT
50
−0.7
1
5
100
-1.4
125
600
mA
mA /°C
A
V
mW
mW / °C
°C
V
100
mA
50
-1.1 mA /°C
2
A
1.2
A
300
mW
−4.0 mW / °C
115
°C
−40 to100 °C
−55 to125 °C
260
°C
330
mW
ΔPT / °C
-4.4 mW / °C
BVS
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The devices are considered two-terminal devices: pins 1,2 and 3 are shorted together, as are pins 4 and 6.
Recommended Operating Conditions
Characteristic
Supply voltage
Symbol
Min
Typ.
Max
Unit
VAC
—
—
240
Vac
Forward current
IF
15
20
25
mA
Peak on-state current
Operating temperature
ITP
—
—
1
A
Topr
−25
—
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
devices. Each item also has its own independent guideline document. In developing designs using this
product, please confirm the specified characteristics shown in these documents.
© 2019
2
Toshiba Electronic Devices & Storage Corporation
2019-06-24
