Absolute Maximum Ratings (Ta = 25°C)
TLP4026G
Characteristics
Symbol
Rating
Unit
Forward current
Forward current derating (Ta ≥ 25°C)
Peak forward current
Reverse voltage
Diode power dissipation
Diode power dissipation derating (Ta ≥ 25°C)
Junction temperature
Off-state output terminal voltage
On-state current
One channel operation
Two channel operations
(1a1b simultaneous operation)
IF
∆IF/°C
IFP
VR
PD
△PD / °C
Tj
VOFF
ION
50
mA
−0.5
mA/°C
1
A
5
V
50
mW
-0.5
mW/°C
125
°C
350
V
120
mA
On-state current derating
(Ta ≥ 25°C)
One channel operation
Two channel operations
(1a1b simultaneous operation)
∆ION/°C
−1.2
mA/°C
Output power dissipation
Output power dissipation derating (Ta ≥ 25°C)
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature (10 s)
Isolation voltage (AC, 60 s, R.H. ≤ 60 %)
(Note 1)
PO
ΔPO / °C
Tj
Tstg
Topr
Tsol
BVS
370
−3.7
125
−55 to 125
−40 to 85
260
1500
mW
mW / °C
°C
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together.
Recommended Operating Conditions
Characteristics
Symbol
Min Typ. Max Unit
Supply voltage
Forward current
On-state current
Operating temperature
VDD
―
―
280
V
IF
5
―
25
mA
ION
―
―
120 mA
Topr
−20
―
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this product,
please confirm specified characteristics shown in this document.
© 2019
2
Toshiba Electronic Devices & Storage Corporation
2019-06-24
