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Toshiba Electronic Components Datasheet

TLP701AF Datasheet

Photocoupler

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Photocouplers Infrared LED & Photo IC
TLP701AF
TLP701AF
1. Applications
• Industrial Inverters
• MOSFET Gate Drivers
• IGBT Gate Drivers
• Induction Cooktop and Home Appliances
2. General
The TLP701AF is a photocoupler in a SDIP6 package that consists of an infrared LED optically coupled to an
integrated high-gain, high-speed photodetector IC chip. The TLP701AF is physically smaller than the one in an
8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides
a smaller footprint solution for applications that require safety standard certification. The TLP701AF has an
internal Faraday shield that provides a guaranteed Common-mode transient immunity of ±20 kV/µs. It has a
totem-pole output that can both sink and source current. It is ideal for IGBT and power MOSFET gate drive.
Leads of the TLP701AF is bend to satisfy 8 mm PC board spacing requirements. Absolute maximum ratings and
electrical characteristics are the same as in the TLP701A.
3. Features
(1) Output peak current: ±0.6 A (max)
(2) Operating temperature: -40 to 100
(3) Supply current: 2 mA (max)
(4) Supply voltage: 10 to 30 V
(5) Threshold input current: 5 mA (max)
(6) Propagation delay time: 500 ns (max)
(7) Common-mode transient immunity: ±20 kV/µs (min)
(8) Isolation voltage: 5000 Vrms (min)
(9) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
Note 1: When a VDE approved type is needed, please designate the Option (D4).
©2016-2020
Toshiba Electronic Devices & Storage Corporation
1
Start of commercial production
2011-01
2020-02-17
Rev.6.0


Toshiba Electronic Components Datasheet

TLP701AF Datasheet

Photocoupler

No Preview Available !

4. Packaging and Pin Configuration
11-5J101S
5. Internal Circuit (Note)
TLP701AF
1: Anode
2: N.C.
3: Cathode
4: GND
5: VO(Output)
6: VCC
Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.
6. Principle of Operation
6.1. Truth Table
Input
H
L
LED
ON
OFF
M1
ON
OFF
M2
OFF
ON
Output
H
L
6.2. Mechanical Parameters
Characteristics
Creepage distances
Clearance distances
Internal isolation thickness
7.62-mm Pitch
TLP701A
7.0 (min)
7.0 (min)
0.4 (min)
10.16-mm Pitch
TLP701AF
Unit
8.0 (min)
mm
8.0 (min)
0.4 (min)
©2016-2020
Toshiba Electronic Devices & Storage Corporation
2
2020-02-17
Rev.6.0


Part Number TLP701AF
Description Photocoupler
Maker Toshiba
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TLP701AF Datasheet PDF






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