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TLP701AF - Photocoupler

Features

  • (1) Output peak current: ±0.6 A (max) (2) Operating temperature: -40 to 100 (3) Supply current: 2 mA (max) (4) Supply voltage: 10 to 30 V (5) Threshold input current: 5 mA (max) (6) Propagation delay time: 500 ns (max) (7) Common-mode transient immunity: ±20 kV/µs (min) (8) Isolation voltage: 5000 Vrms (min) (9) Safety standards UL-recognized: UL 1577, File No. E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No. E67349 VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1) Note 1: Whe.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Photocouplers Infrared LED & Photo IC TLP701AF TLP701AF 1. Applications • Industrial Inverters • MOSFET Gate Drivers • IGBT Gate Drivers • Induction Cooktop and Home Appliances 2. General The TLP701AF is a photocoupler in a SDIP6 package that consists of an infrared LED optically coupled to an integrated high-gain, high-speed photodetector IC chip. The TLP701AF is physically smaller than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. The TLP701AF has an internal Faraday shield that provides a guaranteed Common-mode transient immunity of ±20 kV/µs. It has a totem-pole output that can both sink and source current.
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