TMP95CS64FG Datasheet | Toshiba

TOSHIBA Original CMOS 16-Bit Microcontroller TLCS-900/H Series TMP95CS64FG/TMP95C265FG Semiconductor pany TMP95CS64/TMP95C265 Document Change Notification The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a substitute for a revision of the datasheet. Changes to the datasheet may include the following, though not all of them may apply to this particular device. 1. Part number Example: TMPxxxxxx F → TMPxxxxxx FG All references to the previous part number were left unchanged in body text. The new part number is indicated on the prelims pages (cover page and this notification). 2. Package code and package dimensions Example: LQFP100-P-1414-0.50C → LQFP100-P-1414-0.50F All references to the previous package code and package dimensions were left unchanged in body text. The new ones are indicated on the prelims pages. 3. Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added. 4. RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text. A new replacement is included on the next page. 5. Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device. 2008-02-20 TMP95CS64/TMP95C265 1. Part number Previous Part Number (in Body Text) TMP95CS64F/TMP95C265F New Part Number TMP95CS64FG/TMP95C265FG 2. Package code and dimensions Previous Package Code (in Body Text) New Package Code P-LQFP100-1414-0.50F LQFP100-P-1414-0.50F - : For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Solderability of lead free products Test Parameter Solderability Test Condition Use of Sn-37Pb...