TLP620,TLP620−2,TLP620−4
UL recognized
BSI approved
Made In Japan
Made In Thailand
E67349
7426, 7427
*1 E152349
*2 7426, 7427
*1
*2
*1 UL1577
*2 BS EN60065: 2002, BS EN60950-1: 2002
• Isolation voltage: 5000Vrms (min.)
• Option (D4) type
VDE approved: DIN EN 60747-5-2, certificate no.40009302
Maximum operating insulation voltage: 890VPK
Highest permissible over voltage: 8000VPK
(Note) When an EN 60747-5-2 approved type is needed,
please designate the “Option(D4)”.
• Creepage distance: 6.4mm (min.)
Clearance: 6.4mm (min.)
Insulation thickness: 0.4mm (min.)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Forward current
Forward current derating
Pulse forward current
Power dissipation (1 circuit)
Power dissipation derating
Junction temperature
Collector−emitter voltage
Emitter−collector voltage
Collector current
Collector power dissipation
(1 circuit)
Symbol
IF (RMS)
∆IF / °C
IFP
PD
∆PD / °C
Tj
VCEO
VECO
IC
PC
TLP620
60
Rating
TLP620−2
TLP620−4
50
−0.7 (Ta ≥ 39°C)
−0.5 (Ta ≥ 25°C)
1 (100μs pulse, 100pps)
100 70
−1.0 −0.7
125
55
7
50
150 100
Unit
mA
mA / °C
A
mW
mW / °C
°C
V
V
mA
mW
Collector power dissipation
derating (1 circuit) (Ta ≥ 25°C)
∆PC / °C
−1.5
−1.0 mW / °C
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature
Total package power dissipation
Total package power dissipation
derating (Ta ≥ 25°C, 1 circuit)
Tj
Tstg
Topr
Tsold
PT
∆PT / °C
125
−55~125
−55~100
260 (10s)
250 150
−2.5 −1.5
°C
°C
°C
°C
mW
mW / °C
Isolation voltage
BVS
5000 (AC, 1 min., RH ≤ 60%)
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
2 2014-09-22
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