TQRLC - Advanced Passives Foundry Service

Description

TriQuint’s TQRLC is a pure passives process.

It is targeted at high performance, small size passive-only circuits and utilizes over 9 µm of gold metal.

High density interconnections are accomplished with three thick global and one surface metal interconnect layers.

Features

TQRLC TQTRx.
Thick 4 Layer Metal; > 9 µm total thickness High Density Interconnects:.
3 Global.
1 Local High-Q Passives; Inductor Q >50 @ 2 GHz Low Cost: Passives Only Thin Film Resistors Dielectric Encapsulated Metals Planarized Surface; simplified plastic packaging Volume Production Process TQRLC TQTRx Process Cross-Section.

TriQuint Semiconductor

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Datasheet Details

Part number	TQRLC
Manufacturer	TriQuint Semiconductor
File Size	426.01 KB
Description	Advanced Passives Foundry Service
Datasheet	TQRLC Datasheet
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Production Released Process www.DataSheet4U.com Advanced PassivesFoundry Foundry Service Service GaAs MESFET Features • • TQRLC TQTRx • • • • • • Thick 4 Layer Metal; > 9 µm total thickness High Density Interconnects: • 3 Global • 1 Local High-Q Passives; Inductor Q >50 @ 2 GHz Low Cost: Passives Only Thin Film Resistors Dielectric Encapsulated Metals Planarized Surface; simplified plastic packaging Volume Production Process TQRLC TQTRx Process Cross-Section Applications • General Description TriQuint’s TQRLC is a pure passives process. It is targeted at high performance, small size passive-only circuits and utilizes over 9 µm of gold metal. High density interconnections are accomplished with three thick global and one surface metal interconnect layers.

Published: Aug 9, 2009 |