Datasheet4U Logo Datasheet4U.com

MA4SPS302 - Surface Mount Monolithic PIN Diode Chip

General Description

M/A-COM’s MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM’s patented HMIC™ process.

Key Features

  • Surface Mount Diode No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) Case Style ODS-12471, 2 A B.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
MA4SPS402 PIN Diode MA-COM
MA4SPS420 (MA4SPS420 Series) SURMOUNT PIN Diodes Tyco Electronics
MA4SPS421 (MA4SPS420 Series) SURMOUNT PIN Diodes Tyco Electronics
MA4SPS422 (MA4SPS420 Series) SURMOUNT PIN Diodes Tyco Electronics
MA4SPS502 PIN Diode MA-COM

Other Datasheets by Tyco Electronics (now TE Connectivity)

Part Number Description
MA4ST079 Surface Mount Hyperabrupt Wide-Band Tuning Varactors
MA4ST080 Surface Mount Hyperabrupt Wide-Band Tuning Varactors
MA4ST081 Surface Mount Hyperabrupt Wide-Band Tuning Varactors
MA4ST082 Surface Mount Hyperabrupt Wide-Band Tuning Varactors
MA4ST083 Surface Mount Hyperabrupt Wide-Band Tuning Varactors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MA4SPS302 SurMount™ Series Surface Mount Monolithic PIN Diode Chip Features • • • • • • • Surface Mount Diode No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) Case Style ODS-12471, 2 A B Description M/A-COM’s MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal side walls conductive. Selective backside metalization is applied producing a surface mount device.