MA4DP918-1277 Datasheet, Tyco Electronics

n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds R.

3 mm square MLP Plastic Package V 1.00 MA4DP918-1277 Features n n n n n n n 3mm MLP Plastic Package HMIC Integrated.

The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low.