MAAP-007899 Datasheet | Tyco Electronics

.. Ro HS pliant MAAP-007899 V3P Block Diagram High Power Linear Amplifier 5.7 - 5.9 GHz Features - Ideal for 802.11a MESH and Access Point, 5.8 GHz Wi Max, and other Linear Applications - Linear Pout: 20 d Bm (802.11a Signal, 3% EVM) - IP1d B: +28 d Bm Typical - Small Signal Gain: 23 d B Typical - EVM: 3% at 20 d Bm Linear (OFDM) POUT - Lead-Free 4 mm 16 lead PQFN Package - 100% Matte Tin Plating over Copper - Halogen-Free “Green” Mold pound - Ro HS- pliant and 260°C Reflow patible Description M/A-’s MAAP-007899 RF power amplifier is a three stage Ga As MMIC designed specifically for 5.7-5.9 GHz Wi Max 802.16 and 802.11a applications. The power amplifier maintains high linearity under OFDM modulation. The MAAP-007899 is fabricated using a high reliability Ga As HBT process to realize low current and high power functionality. The process Features full passivation for increased performance and reliability. Pin Configuration Pin 1 2 3 4 5 6 Pin Name VCS N/C RFIN N/C N/C VEN N/C N/C N/C RFOUT/VCC3 RFOUT/VCC3 RFOUT/VCC3 N/C VCC2 N/C VCC1 Paddle Description Bias Supply Voltage No Connection RF Input No Connect No Connect Power Enable No Connection No Connection No Connection RF Output, 3rd Stage Supply RF Output, 3rd Stage Supply RF Output, 3rd Stage Supply No Connection 2nd Stage Supply No Connection 1st Stage Supply RF & DC Ground Ordering Information Part Number MAAP-007899-TR1000 MAAP-007899-TR3000 MAAP-007899-001SMB Package 1000 piece reel 3000 piece...