* For surface mounted applications in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low inductance * Plastic.

in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low induc.

1.5SMCJ8.5C

1.5SMCJ8.5

1.5SMCJ8.5A

1.5SMCJ8.0

1.5SMCJ8.0A

1.5SMCJ8.0AC

1.5SMCJ8.0C

1.5SMCJ8.0CA

1.5SMCJ8.2A

1.5SMCJ8.2CA

1.5SMCJ80

1.5SMCJ80A

1.5SMCJ80C

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