* For surface mounted applications in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low inductance * Plastic.

in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low induc.

1.5SMCJ9.0C

1.5SMCJ9.0

1.5SMCJ9.0A

1.5SMCJ9.1A

1.5SMCJ9.1CA

1.5SMCJ90

1.5SMCJ90A

1.5SMCJ90C

1.5SMCJ90CA

1.5SMCJ91A

1.5SMCJ91CA

1.5SMCJ10

1.5SMCJ100

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