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UCC2915 Datasheet Preview

UCC2915 Datasheet

15-V Programmable Hot Swap Power Manager

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ą UCC2915, UCC3915
15ĆV PROGRAMMABLE HOT SWAP POWER MANAGER
D Integrated 0.15-Power MOSFET
D 7-V to 15-V Operation
D Digital-Programmable Current Limit from
0 A to 3 A
D 100-µA ICC When Disabled
D Programmable On Time
D Programmable Start Delay
D Fixed 2% Duty Cycle
SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
D Thermal Shutdown
D Fault-Output Indicator
D Maximum-Output Current Can Be Set to 1 A
Above the Programmed-Fault Level or to a
Full 4 A
D Power SOIC and TSSOP, Low Thermal
Resistance Packaging
description
The UCC3915 programmable hot swap power manager provides complete power-management, hot-swap
capability, and circuit breaker functions. The only external component required to operate the device, other than
power supply bypassing, is the fault-timing capacitor, CT. All control and housekeeping functions are integrated,
and externally programmable. These include the fault current level, maximum output sourcing current,
maximum fault time, and startup delay. In the event of a constant fault, the internal fixed 2% duty cycle ratio limits
average output power.
The internal 4-bit DAC allows programming of the fault-level current from 0 A to 3 A with 0.25-A resolution. The
IMAX control pin sets the maximum-sourcing current to 1 A above the trip level or to a full 4 A of output current
for fast output capacitor charging. (continued)
block diagram
IMAX 10
H=4A
4A
1A
ABOVE
FAULT
MAX
CURRENT
LEVEL
CURRENT FAULT
LEVEL 0–3 A
0–3 A
0.25
RES
CHARGE
PUMP
REVERSE VOLTAGE
COMPARATOR
+
30 mV
VOUT
CURRENT SENSE
+
LINEAR CURRENT
AMPLIFIER
H = OPEN
2 VIN
3 VIN
POWER
FET *
OVER CURRENT
COMPARATOR
+
ON TIME
CONTROL
2% DUTY
CYCLE
THERMAL
SHUTDOWN
INTERNAL
BIAS
14 VOUT
15 VOUT
1.5 V
+
1 SHTDWN
6789
5 4 13 12
B3 B2 B1 B0
4 BIT DAC
GND HEAT SINK
GND PINS
NOTE: Pin numbers refer to DIL-16 and SOIC-16 packages.
11 16
CT FAULT
UDG-99174
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 2000, Texas Instruments Incorporated
1




Unitrode

UCC2915 Datasheet Preview

UCC2915 Datasheet

15-V Programmable Hot Swap Power Manager

No Preview Available !

UCC2915, UCC3915
15ĆV PROGRAMMABLE HOT SWAP POWER MANAGER
ą
SLUS198C FEBUARY 2000 - REVISED - JUNE 2001
description (continued)
When the output current is below the fault level, the output MOSFET is switched on with a nominal ON resistance
of 0.15 . When the output current exceeds the fault level, but is less than the maximum-sourcing level, the
output remains switched on, but the fault timer starts, charging CT. Once CT charges to a preset threshold, the
switch is turned off, and remains off for 50 times the programmed fault time. When the output current reaches
the maximum sourcing level, the MOSFET transitions from a switch to a constant current source.
The UCC3915 can be put into sleep mode, drawing only 100 µA of supply current. Other features include an
open-drain fault-output indicator, thermal shutdown, undervoltage lockout, 7-V to 15-V operation, and
low-thermal resistance SOIC and TSSOP power packages.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.5 V
VOUT VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.3 V
FAULT sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
FAULT voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 8 V
Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self limiting
TTL input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to VIN
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 150°C
Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data Book (TI Literature
Number SLUD002) for thermal limitations and considerations of packages.
package information
DIL-16, SOIC-16
N, DP Package
(TOP VIEW)
TSSOP-24,
PWP Package
(TOP VIEW)
SHTDWN 1
VIN 2
VIN 3
GND* 4
EGND* 5
B3 6
B2 7
B1 8
16 FAULT
15 VOUT
14 VOUT
13 GND*
12 GND*
11 CT
10 IMAX
9 B0
SHTDWN 1
VIN 2
VIN 3
N/C 4
GND* 5
GND* 6
GND* 7
GND* 8
EGND* 9
B3 10
B2 11
B1 12
24 FAULT
23 VOUT
22 VOUT
21 N/C
20 GND*
19 GND*
18 GND*
17 GND*
16 N/C
15 CT
14 IMAX
13 B0
*Pin 5 serves as lowest impedance to the electrical
ground; Pins 4, 12, and 13 serve as heat sink/ground.
These pins should be connected to large etch areas to
help dissipate heat. For N Package, pins 4, 12, and 13
are N/C.
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins should
be connected to large etch areas to help dissipate heat.
2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265


Part Number UCC2915
Description 15-V Programmable Hot Swap Power Manager
Maker Unitrode
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UCC2915 Datasheet PDF






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