eSMP TM Series
* Very low profile - typical height of 1.0 mm
* Ideal for automated placement
* Glass passivated chip junction
* Ultrafast recovery times .
For use in secondary rectification and freewheeling for ultrafast swit ching spe eds o f a c-to-ac an d dc- to-dc conver.
High Current Density Surface Mount Ultrafast Rectifiers
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