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VTM
PRELIMINARY
V•I ChipTM – VTM
Voltage Transformation Module
• 48 V to 48 V V•I Chip Converter
• 6.3 A (9.4 A for 1 ms)
• High density – 1218 W/in3
• Small footprint – 280 W/in2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
• 125°C operation
• 1 µs transient response
• 3.5 million hours MTBF
• Typical efficiency 96%
• No output filtering required
• Surface mount BGA or J-Lead
packages
V048K480T006
K indicates BGA configuration. For other
mounting options see Part Numbering below.
©
Vf = 26 - 55 V
VOUT = 26.0 - 55.0 V
IOUT = 6.3 A
K=1
ROUT = 200.0 mΩ max
Actual size
Product Description
The V048K480T006 V•I Chip Voltage Transformation
Module (VTM) excels at speed, density and efficiency to
meet the demands of advanced power applications
while providing isolation from input to output. It
achieves a response time of less than 1 µs and delivers
up to 6.3 A in a volume of less than 0.25 in3 with
unprecedented efficiency. It may be paralleled to deliver
higher power levels at an output voltage settable from
26.0 to 55.0 Vdc.
The VTM V048K480T006’s nominal output voltage is
48 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 26.0 to 55.0 Vdc at no load, and from
24.8 to 53.9 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K =1 , for applications requiring an isolated output
voltage with high efficiency. Closing the loop back to an
input Pre-Regulation Module (PRM) or DC-DC converter
enables tight load regulation.
The 48 V VTM achieves a power density of 1218 W/in3 in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip BGA package supports in-board mounting with
a low profile of 0.16" (4 mm) over the board. A J-lead
package option supports on-board surface mounting
with a profile of only 0.25" (6 mm) over the board. The
VTM’s fast dynamic response and low noise eliminate the
need for bulk capacitance at the load, substantially
increasing system density while improving reliability and
decreasing cost.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
VC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature(1)
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 60.0
2,250
6.3
9.4
337
505
208
-40 to 125
-55 to 125
Storage temperature
-40 to 150
-65 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
T - Grade
M - Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
V 048
Voltage
Transformation
Module
Input Voltage
Designator
K
Configuration Options
F = On-board (Figure 15)
K = In-board (Figure 14)
480
Output Voltage
Designator
(=VOUT x10)
T
006
Output Current
Designator
(=IOUT)
Product Grade Temperatures (°C)
Grade Storage Operating
T -40 to150 -40 to125
M -65 to150 -55 to125
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K480T006
Rev. 1.0
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